These chambers are typically used for thermal stress testing of
circuit boards and equipment.
Rapid temperature changes are produced by using liquid nitrogen
to cool the chambers. Temperature changes of up to 25
degree C per minute are experienced by the test samples.
An air to air thermal shock machine is also available which
can transfer samples from a zone at high temperature (up
to 125 degree C) to a zone at low temperature (as low as -60
degrees C) in less than 30 seconds.