Our team has many years of specialised experience in testing and analysis of telecommunications and related products.. This experience means that we are well placed to both advise on, and carry out, testing of your product to the relevant international specifications.

• Barry Lamb [ Materials Analysis/Environmental / Structural] [more...]

  Experience: Barry has been involved in all aspects of materials and components analysis for over 25 years, using optical and electron microscopy. His main interests are in printed circuit board (PCB) and component failure analysis, corrosion phenomena and investigation of fire or flood damaged equipment/installations. He has a BSc in Physics and did his PhD in corrosion engineering.

  
  
• Chester Jones [RGA / Materials / Environmental] [more...]

   

  Experience: Chester has over 25 years of experience in the field of electronic and optoelectronic component analysis and testing using Scanning Electron Microscopy and related Vacuum based techniques. For the last 12 years he has been responsible for the provision of the only MIL STD approved residual gas analysis facility in the UK. He has a degree in Physics and a PhD in Surface Science.

• Mike Hurley [EMC Testing/Environmental] [more...]

  Experience: Mike has been involved in the testing industry for the last 35 years, initially in audio/telephony and environmental testing. For the last 18 years he has specialised in EMC and has represented the FEI on the BSI GEL110 national committee and has been a member of the ETSI ERM EMC committee producing European standards. He holds a first class honours degree.

  
  
• Vin Tonks [EMC/Safety] [more...]

• Experience: Vin has spent over 30 years working in the electronics industry and has considerable experience of the design, testing and certification of both telecommunications and medical equipment. He is well placed to advise on all aspects of both Safety and EMC testing.